Wire bonding

Our wire bonding material and equipment

Ball/Wedge bond 20-25µm gold wire.

Ball/Wedge bond 20-25µm gold wire.

K&S iConn+ Ball/Wedge bond Au 17-70 micron. Fine pitch to 30 micron. Positional accuracy up to 2 micron.

K&S iConn+ Ball/Wedge bond Au 17-70 micron. Fine pitch to 30 micron. Positional accuracy up to 2 micron.

Delvotec 5630 Wedge-Wedge bonding up to 300 µm, other sizes on request.  Al, Cu and Au.

Delvotec 5630 Wedge-Wedge bonding up to 300 µm, other sizes on request. Al, Cu and Au.

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