As die-carrier we can use lead frames, substrate (metal, ceramic, FR4, others), flex-foils, reel-to-reel or wafer-level substrates. These can be combined with again all packaging solutions and window/exposed area combinations.
Customized design, QFN, exposed window on reel to reel substrate, over-molded with black epoxy compound
Leadframe, over-molded with black epoxy
Flex foil substrate, over-molded with black epoxy
Wafer carrier, with exposed area, over-molded with liquid silicon compound