Various die-carriers

As die-carrier we can use lead frames, substrate (metal, ceramic, FR4, others), flex-foils, reel-to-reel or wafer-level substrates. These can be combined with again all packaging solutions and window/exposed area combinations.

Customized design, QFN, exposed window on reel to reel substrate, over-molded with black epoxy compound

Customized design, QFN, exposed window on reel to reel substrate, over-molded with black epoxy compound

Leadframe, over-molded with black epoxy

Leadframe, over-molded with black epoxy

Flex foil substrate, over-molded with black epoxy

Flex foil substrate, over-molded with black epoxy

Wafer carrier, with exposed area, over-molded with liquid silicon compound

Wafer carrier, with exposed area, over-molded with liquid silicon compound

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