Extended solutions

APC is able to utilize several standard packaging solutions such as: (open-) QFN, DFN, QFP, SIL, DBS, DIP/ DIL, BGA, LGA, SO. With our Film Assisted Molding (FAM) and Dynamic Insert Control (DIC) technologies we can customize any of these standard packaging solutions to include open windows or exposed areas.

SO-package, exposed window, over-molded with black epoxy.

SO-package, exposed window, over-molded with black epoxy.

Ceramic PGA-package

Ceramic PGA-package

Open QFN over-molded with black epoxy

Open QFN over-molded with black epoxy

QFN, exposed window, over-molded with black epoxy

QFN, exposed window, over-molded with black epoxy

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