Exposed window

Our Film Assisted Molding (FAM) and Dynamic Insert Control (DIC) Technologies are perfectly suitable for robust packages with exposed areas or windows. These solutions are interesting for sensors, MEMs, optical devices/LEDs, power devices, medical or other advanced ICs.

QFN sensor-packaging with exposed window, over-molded with black epoxy

QFN sensor-packaging with exposed window, over-molded with black epoxy

Standard QFN package, with exposed window, over-molded with black epoxy

Standard QFN package, with exposed window, over-molded with black epoxy

Standard QFN package, with exposed window, over-molded with black epoxy

Standard QFN package, with exposed window, over-molded with black epoxy

home footer