Project leader _ Sr package and assembly engineer package development

Advanced Packaging Center BV is looking for a new colleague:

Function: Project leader / Sr. package and assembly engineer package development.

Job Description:

  • Development of new packages for the Semiconductor industry with a focus on MEMS, sensors, powers and advanced IC’s (translate the customer demand/wishes into new packaging concepts).
  • As project leader responsible for:
    • project budget and monthly report
    • project planning and communication with the customer
    • identify commercial and technical risks
  • Getting deep understanding of the customer requirements and building up a strong customer relationship.
  • Reporting, measuring and investigation of the developed products.

Profile:

  • Specialist on back-end processes with respect to the applied technologies and innovations.
  • HBO / TU degree in Mechanical engineering / Electrical engineering or comparable degree.
  • Several years’ experience in plastic package development and back-end assembly technologies.
  • Practical knowledge of semiconductor back-end processes.
  • Excellent control of English language (verbal and writing), Dutch is an asset.
  • Structural way of working and analytic.
  • Knowledgeable, focused on result, creative, team player and proactive.

Contact person APC: Marco Koelink (This email address is being protected from spambots. You need JavaScript enabled to view it.)

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